Microelectromechanical system (MEMS) devices are specialized electronic devices that integrate the benefits of both mechanical and electrical structures. However, the contact behavior between the interfaces of these structures can significantly impact the performance of MEMS devices, particularly when the surface roughness approaches the characteristic size of the devices. In such cases, the contact between the interfaces is not a perfect face-to-face interaction but occurs through point-to-point contact. As a result, the contact area changes with varying contact pressures and surface roughness, influencing the thermal and electrical performance. By integrating the CMY model with finite element simulations, we systematically explored the thermal conductance regulation mechanism of MEMS contact switches. We analyzed the effects of the contact pressure, micro-hardness, surface roughness, and other parameters on thermal conductance, providing essential theoretical support for enhancing reliability and optimizing thermal management in MEMS contact switches. We examined the thermal contact, gap, and joint conductance of an MEMS switch under different contact pressures, micro-hardness values, and surface roughness levels using the CMY model. Our findings show that both the thermal contact and gap conductance increase with higher contact pressure. For a fixed contact pressure, the thermal contact conductance decreases with rising micro-hardness and root mean square (RMS) surface roughness but increases with a higher mean asperity slope. Notably, the thermal gap conductance is considerably lower than the thermal contact conductance.
Chen et al. (Mon,) studied this question.