Abstract The increasing demand for compact, cost-effective electronics in various applications has made advanced thermal management systems capable of handling high power densities and thermal stress critical in aerospace applications. This study aims to determine the critical limits of single-phase liquid cooling systems to ensure reliability and efficiency for electronic cooling. A single-phase liquid cooling setup from previous work for heterogeneous integration was used to validate the simulation model. Key parameters to be examined include pressure endurance, flow rate capacity, thermal hotspots, thermal resistance before failure occurs in sensitive components, where replacement is costly and challenging. Flow rate limitations will be assessed to identify what parameters restrict the cooling performance. Additionally, thermal analysis will evaluate heat dissipation across various chip hotspots, to simulate real-world power density distributions. The study examines the effectiveness of single-phase cooling on various heat sink configurations including pin, rectangular, and diamond heat sinks. The different heat sink designs are compared regarding pressure drop, thermal resistance, and junction temperature. Results show that the diamond staggered configuration for the heat sink promises to achieve the best cooling performance, contributing to improving cooling efficiency and energy management in data centers.
Abuhasheh et al. (Tue,) studied this question.