Key points are not available for this paper at this time.
Abstract Thermoplastic polyimides (TPIs) can meet the requirements of advanced electronic packaging such as flexible copper clad laminate (FCCL) applied under extreme conditions, attributed to their excellent thermal stability, mechanical properties, electrical insulation and chemical resistance. With the increasing demands for electronic devices, such as applications in high‐frequency communication, it is highly desirable to develop high‐performance TPI with good thermoplasticity, thermal stability, mechanical properties and dielectric properties. However, there is a trade‐off between thermoplasticity and other properties. Herein, we introduce an effective strategy to afford TPIs with good performance by copolymerization of a diamine monomer consisted of a coplanar aromatic carbazole group and a short flexible linkage methylene group. On the one hand, short flexible linkages help improve the flexibility of polymer chains and are not too much to enable small‐scale molecular motions below T g . On the other hand, coplanar aromatic donor groups benefit to strong charge transfer complex (CTC) interaction and π‐π stacking interaction. Based on this strategy, the resultant TPI possesses good thermoplasticity with a proper T g of 348 °C. Meanwhile, it preserves a low coefficient thermal expansion of 48 ppm K −1 , low dielectric constant/dielectric loss factor of 3.27/0.0073 at 10 GHz, and tensile strength of ca. 78 MPa.
Du et al. (Wed,) studied this question.