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With the development of 5G technology and increasing chip integration, traditional active cooling methods struggle to meet the growing thermal demands of chips. Thermoelectric Coolers (TECs) have garnered attention due to their rapid response, significant cooling differentials, strong compatibility, high stability, and controllable device dimensions. This review, starting from the fundamental principles of thermoelectric cooling and device design, summarizes high-performance thermoelectric cooling materials and comprehensively reviews the progress of advanced on-chip TECs. Finally, the paper outlines the challenges and opportunities in TEC design, performance, and applications, emphasizing the critical role of thermoelectric cooling in addressing the evolving thermal management requirements in the era of emerging chip technologies.
Li et al. (Wed,) studied this question.