Large-area metal sinter-joining in power electronics packaging: challenges and perspectives

Key Points

• The aim is to investigate the challenges and potential solutions in metal sinter-joining for power electronics packaging.
• Assessment of current metal sinter-joining techniques
• Examination of applications in new energy vehicles and aerospace
• Analysis of operating temperatures and current densities
• Identified significant challenges in thermal management and material compatibility
• Demonstrated the need for improved manufacturing processes
• Revealed potential advancements in joining techniques for enhanced performance