With the advancement of SiC wafers toward 12 inches and innovations in laser cutting technology, new demands have emerged for SiC grinding techniques—namely, high efficiency, low loss, and low wear ratio. This paper investigates electrochemical-assisted grinding of SiC using a grinding wheel–SiC pair model system, examining the effects of electrolyte type, concentration, voltage, load, and rotational speed on wear behavior. Experimental results reveal that NaCl is the most effective electrolyte among the six candidates tested. In the NaCl system, wear behavior is strongly influenced by the interplay between voltage and rotational speed. At a constant voltage of 3 V, increasing the rotational speed to 600 rpm produces a wear area of 1911.93 μm2, while at a higher voltage of 7 V with a lower speed of 200 rpm, the wear area reaches 1301.96 μm2, indicating that optimal material removal requires synergistic matching of electrical and mechanical parameters. At 2 wt% NaCl, a sudden change in wear behavior occurs at 6–7 min, indicating a dynamic balance between oxide formation and mechanical removal. Rotational speed shows a turning point at 600 rpm, where the wear mechanism shifts significantly, marking the transition to a synergistically enhanced regime. EDS analysis confirms that Na2SO4 increases surface oxygen content by 54.4% compared to deionized water, demonstrating enhanced electrochemical oxidation. The optimal parameter window for synergistic removal is identified as 1–2 wt% NaCl, 5–7 V, 600 rpm, and 100–150 g. This study provides quantitative insights into the synergistic removal mechanism of SiC, offering a theoretical foundation for developing efficient, low-loss electrochemical grinding technologies.
Wu et al. (Sat,) studied this question.
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