Effect of the etched pattern density on the thermal boundary conductance of diamond-copper composite materials

Key Points

• Enhanced thermal boundary conductance is noted with increased etched pattern density, optimizing performance in diamond-copper composites.
• Key evidence indicates that the thermal conductance can be improved significantly, achieving up to 30% better performance under certain conditions.
• Analysis of thermal interface behavior was conducted using nanostructures and composite samples across varying etched pattern densities.
• May enable advancements in thermal management technologies, though practical application may require further validation with real-world materials.