Dissimilar materials joining with polymeric adhesives is expected to be an alternative technique for a bolted joint and allows reduction in weight and improvement in stiffness. For adhesive bonding, it is necessary to evaluate the bond quality nondestructively. Since an interfacial wave propagates along the bonding interface and its characteristics depend on the bond quality, it is expected to be a vital inspection technique for the quality assessment. In this study, well-bonded and poorly bonded specimens were fabricated to evaluate bonding quality based on propagation behavior of the interfacial waves. As a result, no significant differences were observed in the waveform shape and attenuation of the interface waves. However, the group and phase velocities of the interface wave and the wave transmitted through the interface, increased in the poorly bonded specimen. This suggests that propagation velocity can be used as an indicator for evaluating bonding quality.
TANAKA et al. (Wed,) studied this question.