Recent dramatic improvements in computer performance and advances in numerical computation techniques have increased the demand for the use of numerical analysis in the design of information and communication equipment in the microwave region. Users of electromagnetic field analysis software have been increasing the electromagnetic compatibility EMC studies and need the realization of a whole electromagnetic circuit board high-frequency electromagnetic field analysis technique. In this study, we verify the applicability of a parallel element method for microstrip lines with transmission lines on the surface of electronic circuit boards. The verification results basically show that convergence tends to deteriorate with increasing frequency, on the other hand, sometimes improves. In general, when the element edge length is reduced, the mesh becomes finer and the coefficients of the simultaneous equations become very similar, which is considered a disadvantage in solving the matrix equation. The verification results also confirm the need to improve convergence deterioration. Therefore, we considered the basic equations of the high-frequency problem and developed a code for the edge element finite element method from the basic equations to verify the formulation.
YAMADA et al. (Wed,) studied this question.