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A new photon counting X-ray imager with a 4-sided buttable structure is proposed. The imager consists of a stacked structure of a semiconductor detector such as Cadmium Telluride detector and a Si-based Read-Out Integrated Circuit (ROIC). The imager can be arranged in two dimensions with small gaps of less than 100 μm, because input/output pads of the ROIC are located on the back using through silicon via technology. In addition, daisy-chaining between imagers extends the number of tilings without increasing the number of external connections. This allows to connect small imagers to achieve a larger imaging area.
Takagi et al. (Thu,) studied this question.