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Printed circuit boards (PCBs) are indispensable to modern electronics and clean-energy technologies, yet their production relies on energy-intensive processes and fossil-based materials that contribute substantially to global greenhouse gas emissions. While numerous sustainability initiatives and technological innovations have been proposed across the PCB supply chain, their comparative effectiveness and scalability toward net-zero emissions remain unclear. This study synthesizes recent peer-reviewed life cycle assessments (LCA), ISO 14067-based product carbon footprint disclosures, industrial case studies, and policy initiatives to evaluate the environmental sustainability of the PCB supply chain from raw material extraction through manufacturing, distribution, and end-of-life management. By integrating boundary-qualified LCA evidence with industry practices, we identify dominant environmental hotspots associated with copper-intensive materials, electricity-demanding fabrication steps, and limited end-of-life circularity. Our analysis shows that many reported decarbonization measures are fragmented, regionally uneven, or constrained by data transparency, qualification requirements, and regulatory misalignment. To address these gaps, we present a unified synthesis framework comprising five decarbonization strategies: (1) renewable energy integration and energy-efficient manufacturing, (2) sustainable materials and design optimization, (3) circular economy strategies and targeted offsetting, (4) systematic LCA and product carbon footprint, and (5) harmonized industry standards and governance. Rather than treating these strategies as independent solutions, this study evaluates their interactions, feasibility constraints, and relative mitigation potential, providing a structured basis for advancing credible net-zero strategies in the global PCB supply chain.
Negi et al. (Wed,) studied this question.