Review of Evolution and Rising Significance of Wafer-Level Electroplating Equipment in Semiconductor Manufacturing

Electroplating has become a cornerstone technology in semiconductor manufacturing, enabling high-performance interconnects and advanced packaging. Since the introduction of the Damascene Cu process at the 180 nm node, it has evolved to meet the demands for precision, uniformity, and scalability in miniaturized nodes and complex packaging architectures. The shift to horizontal electroplating systems has enhanced uniformity and process stability, particularly for applications such as TSVs, Cu pillars, micro-bumps, and RDLs. Emerging innovations like pulse electroplating, segmented anode control, and AI-driven monitoring are addressing the challenges of fine-pitch interconnects and emerging interconnect materials, such as cobalt. These advancements are critical for high-density interconnects used in AI, HPC, and high-frequency applications. This review explores the advancements in electroplating technologies, focusing on their role in semiconductor manufacturing. It highlights the evolving equipment designs and their implications for achieving precision, scalability, and reliability at advanced nodes. The ongoing development of electroplating equipment and techniques will support the reliability and performance of future semiconductor devices, reinforcing electroplating as a cornerstone technology in advanced packaging and fabrication.