As the mainstream technology solution for deep imaging LiDAR, dToF measurement has been widely applied in emerging fields such as environmental perception and obstacle recognition, 3D terrain reconstruction, real-time motion capture, and drone obstacle avoidance navigation due to its advantages of high resolution, long-range detection capability, and high sensitivity. In order to adapt to functional applications in different scenarios, the resolution of TDC needs to be adjustable and can work normally in different environments. In view of this, this article studies the pixel array and TDC circuit in the chip and locks a voltage-controlled ring oscillator (VCRO) with the same structure as the pixel to a fixed frequency through a PLL structure. Then copy the control voltage of the locked VCRO to the control terminal of the TDC in each pixel. In an ideal situation, this control voltage can make the oscillation frequency of VCRO within the pixel consistent with the locking frequency of VCRO within the PLL, and insensitive to changes in PVT. This study developed a module expandable 16 × 16-pixel array dToF sensor chip based on TDC architecture using CMOS technology. Finally, six configurable 16 × 16-pixel subarrays were integrated and constructed into a 32 × 48 large-scale dToF sensor chip through modular splicing. The top-level layout design was completed using SMIC 180 nm technology, with a layout area of 5285 µm × 3669 µm. Post-simulation verification showed that, under the testing conditions of a 400 MHz system clock and a 33.3 kHz frame rate, the dToF chip system performance indicators were: time measurement resolution of 156 ps, DNL < 1 LSB, INL < 0.85 LSB, and absolute ranging accuracy better than 2.5 cm.
Chen et al. (Fri,) studied this question.