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Guruprasad Katti | Synapse

GK

Guruprasad Katti

3D IC and TSV technologies

Bank of America

About

Research focus

3D IC and TSV technologies

Impact

35 pubs · 1,897 cites · h-index 16

Affiliations

Work Experience

Bank of America

2016 - 2016

Agency for Science, Technology and Research

2012 - 2016

B.M.S. College of Engineering

2015 - 2015

Institute of Microelectronics

2012 - 2015

IMEC

2009 - 2012

Publications