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Lan Peng | Synapse

LP

Lan Peng

3D IC and TSV technologies

University of Electronic Science and Technology of China

About

Research focus

3D IC and TSV technologies

Impact

217 pubs · 3,821 cites · h-index 32

Affiliations

Work Experience

University of Electronic Science and Technology of China

2021 - Present

Hunan University of Science and Technology

2025 - 2025

Hohai University

2025 - 2025

Chinese Academy of Sciences

2025 - 2025

Singapore Polytechnic

2025 - 2025

Publications