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John H. Lau | Synapse

JH

John H. Lau

Electronic Packaging and Soldering Technologies

Micron Corporation (United States)

About

Research focus

Electronic Packaging and Soldering Technologies

Impact

580 pubs · 13,797 cites · h-index 55

Affiliations

Work Experience

Micron Corporation (United States)

2021 - 2025

Nanya Technology (Taiwan)

2020 - 2025

East Asia School of Theology

2021 - 2021

Palo Alto Institute

2021 - 2021

ASM Pacific Technology (China)

2014 - 2019

Publications