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R. Schwerz | Synapse

RS

R. Schwerz

Electronic Packaging and Soldering Technologies

Fraunhofer Institute for Ceramic Technologies and Systems

About

Research focus

Electronic Packaging and Soldering Technologies

Impact

24 pubs · 87 cites · h-index 6

Affiliations

Work Experience

Fraunhofer Institute for Ceramic Technologies and Systems

2014 - Present

Technische Universität Dresden

2011 - 2018

Fraunhofer Society

2013 - 2015

Fraunhofer Institute for Nondestructive Testing

2013 - 2013

Publications