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Co-Packaged Optics - Heterogeneous Integration of Photonic IC and Electronic IC | Synapse

June 4, 2024

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Co-Packaged Optics - Heterogeneous Integration of Photonic IC and Electronic IC

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Resumen

Abstract The trends in co-packaged optics (CPO) will be investigated in this study. Emphasis is placed on the heterogeneous integration of photonic integrated circuit (PIC) and electronic IC (EIC). In particular, two-dimensional (2D) and three-dimensional (3D) heterogeneous integration of application specific IC (ASIC) switch, PIC, and EIC w/o bridges, and heterogeneous integration of ASIC switch, PIC, and EIC on glass substrate will be discussed. Some recommendations will be provided.

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John H. Lau (Tue,) studied this question.

synapsesocial.com/papers/68e6635ab6db6435875f01fc https://doi.org/https://doi.org/10.1115/1.4065667

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