Experimental study of transmission signal performance of sub-2 micron fine-wiring with novel structure

We have developed several types of package substrates mainly made of glass material, including RDL interposer, glass interposer and glass core substrate. Furthermore, we emphasize the importance of elucidating the transmission performance of fine-pitch wiring, as it is a common element in these structures. This paper examines the high-speed transmission characteristics of fine-pitch wiring using glass material. We also focus on the potential for applying high-speed transmission performance to the next generation such as HBM3 and UCIe 1.0 based on the analysis of electromagnetic field simulation and the measurement results obtained from the fine-pitch wiring composed on the glass material.