Solving the Physical Challenges for the Next Generation of Safety Critical & High Reliability Systems

Silicon systems have been part of automobiles for a long time. The physical design methodology to address the quality, reliability, and safety challenges of these systems are common knowledge in the leading automotive semiconductor companies. The rise of trends like autonomous driving (ADAS), software defined vehicles (SDV) and the electrification of our transportation network are giving rise to not only new levels of these challenges, but also many new players in the automotive semiconductor space. The same forces of opportunity which are transforming our society are also the foundation of a transformation in automotive semiconductor design: massive improvements in accelerated compute, 3DIC and chiplet based design, digital twins, and artificial intelligence (AI). We'll discuss how these forces are helping modern automotive semiconductor design and highlight how the electronic design automation (EDA) industry can apply successful principles from earlier eras to these new challenges.