What question did this study set out to answer?

This research aims to improve the adhesion between colorless polyimide films and copper deposits used in electronic circuit boards.

February 5, 2026

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Adhesion Enhancement between Colorless Biphenyl Polyimide Copolymerized Film and magnetron sputtering Cu for FPC circuit board

Puntos clave

This research aims to improve the adhesion between colorless polyimide films and copper deposits used in electronic circuit boards.
Evaluated the adhesion strength of the colorless polyimide film with magnetron sputtered copper
Conducted surface treatments on the polyimide film
Used various testing methods to assess adhesion quality.
Significant improvement in adhesion strength observed after surface treatments
Results support enhanced reliability of circuit boards in electronic applications.

Resumen

Polyimide film (PI) is one of the world's leading thin film insulation materials, which can be used as electronic applications in aerospace, medical, and automotive industries. Colorless polyimide (CPI) has...

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Cite This Study

Liu et al. (Thu,) studied this question.

synapsesocial.com/papers/6984358ff1d9ada3c1fb482b https://doi.org/https://doi.org/10.1039/d5tc03165f

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