Interface engineering of Cu/Cu2O nanowires on Cu foam: boosting C–H bond cleavage and suppressing OH− adsorption for efficient formaldehyde electrooxidation

Puntos clave

• Efficient formaldehyde electrooxidation occurs via enhanced C–H bond cleavage on engineered nanowires.
• Key evidence shows a notable reduction in OH− adsorption during the reaction process on the surface.
• Assessment using the interface engineering method improves the overall catalytic performance significantly.
• This innovation supports future advancements in electrochemical applications and catalysis, aiming for greener processes.