The continuous evolution in semiconductor packaging has driven the demand for advanced materials and processing technologies to meet the requirements of increasingly complex and high-performance devices. Glass, with its unique properties such as excellent thermal stability, electrical insulation, and transparency, has emerged as a promising material in advanced semiconductor packaging. However, realizing the full potential of glass requires innovative micro-processing techniques that go beyond Through Glass Via (TGV) formation. This paper discusses the critical need for advanced glass micro-processing capabilities, such as the creation of open and closed cavities, pre-dicing streets, and microfluidic channels, which are crucial for applications including thermal management and high-density interconnects.Traditional glass processing methods have primarily focused on TGVs, which serve as vertical interconnects in 3D packaging. While TGVs are essential, they alone are insufficient to address the growing complexity of modern semiconductor devices. For instance, the integration of microfluidic channels into glass substrates can significantly enhance thermal management in high-power devices by enabling precise cooling solutions. Similarly, the ability to fabricate open and closed cavities in glass can lead to the development of novel sensor packages and MEMS devices with improved performance and miniaturization. Pre-dicing streets, on the other hand, facilitate easier and more precise singulation of glass wafers and panels, reducing the risk of damage and improving cost efficiency and yield in the packaging process.To achieve these advanced features in glass, conventional processing techniques such as laser drilling plus wet etching, mechanical drilling, and lithography fall short due to limitations in precision, aspect ratio, the potential for introducing defects, and missing industrial scalability. This is where Laser-Induced Deep Etching (LIDE) technology comes into play. LIDE enables high-precision, high-aspect-ratio micro-structuring of glass without compromising material integrity. By leveraging a combination of laser processing and chemical etching, LIDE technology can create intricate features such as microfluidic channels, cavities, and through holes within the same package at unparalleled precision and repeatability.In conclusion, as semiconductor devices continue to shrink in size and increase in functionality, the demand for advanced glass micro-processing capabilities will only grow. LIDE technology represents a significant advancement in this field, offering a robust and versatile solution for creating complex microstructures in glass. By enabling the integration of features such as microfluidic channels, cavities, and pre-dicing streets, LIDE technology supports the development of next-generation semiconductor packages that meet the demands of high-performance, miniaturized devices. This paper highlights the critical role of LIDE in advancing glass processing and its potential to drive innovation in semiconductor packaging.
Noack et al. (Mon,) studied this question.