Parametric effects on secondary deposition modification of 2D SiCf/SiC film cooling hole structures

Puntos clave

• Cooling hole modifications significantly affect thermal performance on SiCf/SiC substrates.
• Parametric effects tested include angles and geometries, improving cooling efficiency by 15%.
• Analysis of deposition techniques reveals optimized structures enhance heat dissipation.
• Findings may enable advanced thermal management strategies in aerospace applications.