Reliability design of power modules: multi time sequence simulation of soldering warpage deformation and fatigue life prediction of solder layers

Puntos clave

• Fatigue life prediction indicates potential issues with solder layers, affecting module reliability.
• Key findings suggest high levels of warpage, threatening the performance of power modules during operation.
• Simulations assess soldering warpage deformation over time, capturing dynamic mechanical behavior and stress.
• Highlights the need for optimization in design processes to improve the durability of electronic components.