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March 3, 2026
Electrodeposited HEDP-based ultrafine-grained Cu Ag alloy foils with ultra-high strength and high conductivity
CY
Chun Cheng Yang
Nanjing Forestry University
BW
Bingtai Wen
HS
Huijuan Shi
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Puntos clave
Ultrafine-grained Cu Ag alloy foils exhibit ultra-high strength and conductivity.
The observed strength is measured at 300 MPa, indicating exceptional durability.
Observational analysis of electrodeposited materials demonstrates effective performance under high stress.
These findings highlight the potential for enhanced applications in electronics and structural materials.
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Cite This Study
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Yang et al. (Thu,) studied this question.
synapsesocial.com/papers/69a75db0c6e9836116a27e28
https://doi.org/https://doi.org/10.1016/j.matchar.2026.116093
Electrodeposited HEDP-based ultrafine-grained Cu Ag alloy foils with ultra-high strength and high conductivity | Synapse