Cross-scale correlation of diffusion bonding parameters for Inconel 625 alloy bonded joint based on molecular dynamics simulations

Puntos clave

• Diffusion bonding parameters show a significant correlation with the bond strength of Inconel 625 alloys.
• Key metrics indicate that varying temperature and pressure affects bonding outcomes considerably.
• Molecular dynamics simulations modeled the bonding process across different scales and conditions.
• Findings emphasize the need for tailored approaches in industrial applications, enhancing bond performance.