Residue-free embedding of electrodeposited copper mesh via interfacial adhesion engineering for high-performance flexible transparent electrodes

Puntos clave

• Flexible transparent electrodes improved through interfacial adhesion engineering and residue-free embedding.
• Key evidence shows a significant increase in performance metrics and durability in multi-layer mesh structures.
• Assessment using electrodeposited copper meshes enhances conductivity and flexibility in material design for applications.
• This approach may enable broader applications in electronic devices, with further exploration needed in practical implementations.