Unveiling the synergistic mechanism of binary additives for tailoring microstructure and enhancing the properties of high-performance electrodeposited copper foils

Puntos clave

• Enhanced properties of high-performance copper foils demonstrated through optimally tailored microstructures, indicating significant improvements.
• Key metric: notable increases in conductivity and strength observed due to binary additive combinations during electrodeposition.
• Analysis of microstructure modifications through electrodeposition using binary additives reveals critical interactions and alterations.
• Supports the potential for tailored copper foils in industrial applications, necessitating further research into microstructural impacts.