In this study, NH2-MgO was employed as a crosslinking agent to covalently link boron nitride (BN) and silicon carbide whiskers (SiCw) via an amidation reaction, yielding the BN-MgO-SiCw hybrid filler. The BN-MgO-SiCw/PBz composites were fabricated using a ball-milling-assisted solution mixing method combined with hot-press molding, and their comprehensive properties were systematically evaluated. The results demonstrate that the BN-MgO-SiCw/PBz composite exhibits excellent thermal conductivity, favorable dielectric properties, superior thermal stability, and outstanding mechanical performance. At a filler loading of 50 wt%, the composite achieved a thermal conductivity of 1.41 W/mK, which is substantially higher than that of the KH560-BN/PBz composite (0.91 W/mK) and approximately 5.2 times that of the neat PBz matrix. The dielectric constant (ε) and dielectric loss (tan δ) of the BN-MgO-SiCw/PBz composite were 6.81 and 0.013, respectively, remaining at relatively low levels. The thermal degradation temperature at 30% weight loss (T30) and the heat resistance index temperature (THRI) reached 572 °C and 244 °C, respectively, both higher than those of the KH560-BN/PBz composite at the same filler loading (511 °C and 224 °C). The tensile strength and flexural strength of the BN-MgO-SiCw/PBz composite were 50.0 MPa and 72.3 MPa, respectively, exceeding those of the KH560-BN/PBz composite (39.4 MPa and 56.2 MPa) while remaining slightly below those of the neat PBz matrix. Collectively, these findings indicate that the BN-MgO-SiCw/PBz composite holds great promise as a novel material with well-balanced comprehensive properties, making it a strong candidate for applications in fields such as electronic packaging.
An et al. (Sun,) studied this question.