Silicon carbide (SiC) has emerged as a highly attractive material for microelectromechanical systems (MEMS) operating in harsh environments, owing to its outstanding mechanical, thermal, and chemical properties. This review provides a comprehensive overview of the advantages and limitations of SiC-based MEMS, with particular emphasis on the strong interdependence between material structure, mechanical properties, and epitaxial growth processes. The role of defects, residual stress, and crystal quality is discussed in relation to device performance and reliability. Special attention is devoted to cubic SiC grown on silicon substrates, highlighting how growth-induced features influence the mechanical response of micromachined structures. Furthermore, a detailed analysis of the quality factor (Q-factor) is presented for 3C-SiC (111)/Si resonators, including the development of analytical models and their validation through numerical simulations performed using COMSOL Multiphysics (Version 6.1). The necessity of incorporating anisotropic loss factors in numerical modeling is demonstrated to be essential for accurately describing the experimentally observed behavior. This review aims to provide design guidelines and modeling strategies for the optimization of SiC MEMS, supporting their further development for high-performance and extreme-environment applications, including pressure sensors, mechanical resonators and high-stress-tolerant sensors.
Garofalo et al. (Tue,) studied this question.