The constant improvement in electronics conducts to more packaged and more dissipative components. Additionally, these developments are combined with the implementation of new materials capable to withstand elevated operating temperatures. The missions for space and telecom are demanding for improved thermal control solutions, capable to transport large amount of heat over long and complex paths with high power density at the hot interface, and operating in the temperature range between 50° C to 100° C. In that context, EHP designed products based on a large experience of two-phase passive cooling technologies and Airbus designed and implement a flight experiment including these components in order to extract flight data on performances and specific limits of thermofluidic thermal control products. The proposed paper aims to describe the technologies and innovations implemented in the in-orbit experience and associated setup, devoted to explore and validate the performance of a thermal bus capable to transport high power level in the operating temperature range between 50° C to 100° C. The resulting performances including discussions on the specificities of thermofluidic heat transport capillary devices will be detailed in the proposed paper, providing design rules and guidelines for future high performance and High temperature applications.
Mohaupt et al. (Sun,) studied this question.