Effect of surface finish on the wettability and electrical resistivity of Sn-3.0Ag-0.5Cu solder

The effect of different surface finish with Sn-3.0Ag-0.5Cu (SAC305) solder was successfully investigated. The SAC305 solder was fabricated by using casting method and solder was placed on copper substrate that coated with different surface finish. The soldering process was carried out by using F4N reflow oven followed up with the mounted and metallographic steps. Wettability of SAC305 solder was observed through contact angle formed between solder and four different surface finish located on the copper substrate. Subsequently, the electrical resistivity of solder was studied by conducted the four-point probes. The results of wettability test was found to be in the accepted range which is below 45° for all different surface finish. In terms of electrical resistivity, the results showed that the ImAg surface finish had enhanced the electrical conductivity of SAC305 lead-free solder.