Abstract ilicon carbide particle reinforced aluminum (SiCp/Al) metal matrix composites are widely employed in safety critical areas, whereby their surface integrity is of high importance. Its machinability has been a significant challenge for industries to keep a desirable surface integrity, while laser assisted machining (LAM) is a promising method to solve the problems. However, the material removal mechanism in LAM of SiCp/Al composite has not been fully revealed, especially the material reaction to the introduced laser thermal and chip formation, which restricts its further improving in material removal rates and surface integrity. To fill in the gaps, the impact mechanisms of laser impact on the surface of silicon carbide–aluminum were investigated. It is worth to note that the cutting-force prediction model for laser-assisted machining was improved by considering laser caused material melting which will change the actual cutting depth. Then, a self-designed cutting transient capture rig was designed to freeze the laser-assisted cutting process (quick-stop), which enables detailed studies of the thermally assisted phenomena, chip formation, and surface generation. New material removal mechanisms are revealed that only pull out and push in phenomena are found in laser assisted scenarios, but conventional machining presents three kinds of conditions (pull out, push in and particle break).
Xu et al. (Wed,) studied this question.