Picosecond laser drilling is characterized by a minimal heat-affected zone (HAZ) and superior surface quality, making it widely utilized for fabricating film-cooling holes in aeroengine turbine blades. However, maintaining consistent drilling quality remains a significant challenge. This study conducts picosecond laser trepanning drilling experiments on a GH4169 nickel-based superalloy to investigate the quality of inclined holes. Due to its excellent high-temperature resistance, creep resistance, and corrosion resistance, GH4169 is a primary material for turbine blades. A control variable method was employed to evaluate the effects of power ratio (60–95%), number of scanning passes (5–40), and defocus amount (−0.2 mm to 0.2 mm) on the quality of inclined holes with tilt angles of 7° and 15° and a sample thickness of 0.5 mm. Entrance diameter, exit diameter, and taper angle were utilized as the key quality indicators. The results indicate that due to the distribution of laser energy flux, both the geometric dimensions and taper angles of 15° inclined holes are significantly larger than those of 7° holes. As the power ratio increases, the entrance and exit diameters exhibit non-linear expansion; a “topographic stability window” is achieved at a 75% power ratio due to the equilibrium in energy coupling. An increase in the number of scanning passes leads to larger diameters; however, excessive scanning slows down the expansion of the exit diameter due to multiple reflection losses within the hole and the accumulation of slag, thereby intensifying taper evolution. The defocus amount exerts a bidirectional regulatory effect: positive defocusing increases the entrance diameter while decreasing the exit diameter, whereas negative defocusing facilitates the expansion of the exit. Optimal hole wall quality is observed at zero defocusing. This work provides data support for parameter optimization and the selection of inclination angles in subsequent laser machining of inclined holes.
Wang et al. (Sun,) studied this question.