Fabrication of Submicrometer Features on Curved Substrates by Microcontact Printing

Microcontact printing (mu CP) has been used to produce patterned self-assembled monolayers (SAMs) with submicrometer features on curved substrates with radii of curvature as small as 25 micrometers. Wet-chemical etching that uses the patterned SAMs as resists transfers the patterns formed by mu CP into gold. At present, there is no comparable method for microfabrication on curved surfaces.