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Integration of laser-induced firing with Ni/Cu plating for TOPCon solar cell metallization | Synapse
March 3, 2026
Integration of laser-induced firing with Ni/Cu plating for TOPCon solar cell metallization
YZ
Yu Zhu
Shanghai International Studies University
XX
Xi Xi
JS
Jianbo Shao
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Key Points
Laser-induced firing improves overall efficiency in TOPCon solar cell metallization, achieving higher conductivity.
The approach utilizes Ni/Cu plating to ensure strong electrical connections and minimize losses in performance.
Analyses indicate significant enhancement in sunlight conversion compared to traditional methods.
This finding highlights the potential for better efficiency in solar technology, advocating for industry adoption.
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Zhu et al. (Thu,) studied this question.
synapsesocial.com/papers/69a75d6fc6e9836116a2778c
https://doi.org/https://doi.org/10.1016/j.solmat.2026.114198