Design of active ester curing agent containing imide and fluorine for plant oil-based epoxy resins with high Tg and low dielectric constant

Key Points

• High thermal properties are achieved with the newly designed curing agent, leading to improved performance.
• The curing agent incorporates imide and fluorine, which contribute to a low dielectric constant of 2.5.
• Assessment involved the synthesis and characterization of the epoxy resin using the active ester curing agent.
• These findings suggest potential advancements in materials suitable for electronic applications.