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Abstract Silicon carbide (SiC) ceramics are widely used in industrial production due to their high strength, excellent wear resistance, and superior thermal stability. However, the hard and brittle nature of SiC ceramics presents challenges such as high processing difficulty, low processing efficiency, and significant tool wear. In this study, we propose a method to enhance the processing efficiency and quality of SiC ceramics by optimizing the machining paths using laser precision milling technology. We achieved the control of machining depth and quality of SiC ceramics by altering the interlayer laser trajectory included angle in multi-layer milling. The results show that changing the interlayer laser trajectory included angle between adjacent milling layer can significantly alter the milling depth and surface roughness. Additionally, within the laser power range of 4-10 W used in the study, the average milling depth increased with the increase of laser power. Meanwhile, the surface processed with 10 W laser power and 45° laser trajectory included angle owning the best surface quality. This research offers valuable data references for the efficient and high-quality processing of SiC ceramics.
LI et al. (Fri,) studied this question.