Near-zero thermal expansion CPO-TLCP composites achieved by in-situ copolymerization: A solution for dimensional stability in electronic devices | Synapse
March 3, 2026
Near-zero thermal expansion CPO-TLCP composites achieved by in-situ copolymerization: A solution for dimensional stability in electronic devices
Key Points
Near-zero thermal expansion enhances dimensional stability in electronic devices, crucial for performance.
CPO-TLCP composites demonstrate a significant reduction in thermal expansion variability under stress conditions.
Analysis highlights the successful in-situ copolymerization method that achieves desired thermal properties.
These findings may enable more durable electronic devices, reducing failure rates linked to thermal challenges.