Thermal stress cleaving is one of the processing methods for brittle materials. It is a technology that is expected to be applied to the semiconductor field, as well as to the cutting of liquid crystal glass and solar panels. It is characterized by the fact that the processed surface becomes mirror-like due to the controlled generation of cracks. In this study, we investigated the generation of mirror-like grooves on glass surfaces caused by the induction of horizontal cracks due to laser-induced thermal stress. As a fundamental study to elucidate the crack initiation mechanism at the bottom of the mirror-like grooves, we discuss the results of processing experiments and stress intensity factor analysis near the fracture surface.
Kubota et al. (Wed,) studied this question.