Key points are not available for this paper at this time.
The effect of the chloride‐to‐sulfate mass ratio (CSMR) on lead leaching from 50:50 lead–tin solder galvanically coupled to copper in stagnant conditions was examined using bench‐scale testing and data from water utilities. The CSMR was significantly altered by coagulant changeover, blending of desalinated seawater, anion exchange, and NaCl brine leaks from onsite hypochlorite generators. Consistent with previous experiences, increasing the CSMR to the range of 0.1 to 1.0 produced dramatic increases in lead leaching from lead–tin solder galvanically coupled to copper. Before implementing any treatment changes that could increase the CSMR, utilities may want to use the protocol described in this article to ascertain the relative effect of the changes on lead corrosion.
Nguyen et al. (Sat,) studied this question.