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Through oxygen profile engineering, we fabricated W/AlO x /Al 2 O 3 /Pt bilayer memristors with a 250-nm feature size. The AlOX fabricated by sputtering serves as an oxygen vacancy source, whereas the Al 2 O 3 deposited by atomic layer deposition acts as a dominant resistive switching (RS) layer. Our devices show forming-free RS behaviors with high speed (28 ns), uniform resistance distribution, large on/off ratio (~10 3 @100K, ~10 3 @298K, and ~80@400K), and good retention. Besides, temperature stability with record high endurance from cryogenic to high-temperature (10 8 @100K, 10 10 @298K, and 10 7 @400K) is demonstrated, to the best of our knowledge.
Huang et al. (Mon,) studied this question.
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