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Michael Pecht | Synapse
MP
Michael Pecht
Electronic Packaging and Soldering Technologies
Life Cycle Engineering (United States)
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About
Research focus
Electronic Packaging and Soldering Technologies
Impact
1,567 pubs · 50,170 cites · h-index 102
Affiliations
Life Cycle Engineering (United States)
University of Maryland, College Park
Hong Kong Polytechnic University
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