Abstract Flexible photonic sensing chips (FPSCs) have emerged as a promising class of devices that integrate optical sensing capabilities with mechanically compliant materials, offering unique advantages such as stretchability, biocompatibility, and electromagnetic interference resistance. These features make them particularly suitable for next‐generation wearable technologies aimed at continuous, non‐invasive multiparameter health monitoring. In recent years, significant progress has been achieved in material engineering, device architecture, and fabrication techniques, enabling flexible photonic chips to achieve high sensitivity, low detection limits, and robust performance under mechanical deformation. Notably, bioinspired design strategies ‐ mimicking the structural and functional characteristics of biological visual and tactile systems ‐ have been increasingly employed to enhance sensing precision and environmental adaptability. This review provides a comprehensive overview of the fundamental principles, materials, and manufacturing processes of FPSCs, followed by an in‐depth discussion of their applications in wearable and implantable health monitoring systems.
Lin et al. (Wed,) studied this question.
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