Oxygen vacancy engineering in Si-doped, HfO2 ferroelectric capacitors using Ti oxygen scavenging layers

In this paper, the ferroelectric properties of TiN/Ti/Si:HfO2/TiN stacks are shown to be modulated by the Ti oxygen scavenging layer, leading to improved remanent polarization and wake-up at low switching fields. Hard x-ray photoelectron spectroscopy is used to measure the oxygen vacancy (VO) concentration in Si-doped HfO2 based capacitors. This VO engineered ferroelectric stack is then assessed at the wafer scale within 16 kbit 1T-1C FeRAM arrays integrated into 130 nm CMOS. The introduction of a Ti oxygen scavenging layer at the top interface of Si:HfO2-based BEOL-integrated metal/ferroelectric/metal capacitors enhances their ferroelectric (FE) behavior (+100% remanent polarization 2.Pr), confirming the positive role of modest concentrations of VO in orthorhombic phase crystallization at low thermal budgets. It is statistically demonstrated at 16 kbit array level that VO-rich FE Si:HfO2 facilitates 2.5 V FeRAM array operation with improved memory window. The field cycling dependence of the memory window is correlated with the VO concentration, and an endurance of 108 cycles is measured at the array level.