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Modern integrated circuits (ICs) take advantage of three-dimensional (3D) nanostructures in devices and interconnects to achieve high-speed and ultra-low-power performance. The choice of electrical insulation materials with excellent dielectric strength, electrical resistivity, strong mechanical strength, and high thermal conductivity becomes critical. Diamond possesses these properties and is recently recognized as a promising dielectric material for the fabrication of advanced ICs, which are sensitive to detrimental high-temperature processes. Therefore, a high-rate low-temperature deposition technique for large-grain, high-quality diamond films of the thickness of a few tens to a few hundred nanometers is desirable. The diamond growth rate by microwave plasma chemical vapor deposition (MPCVD) decreases rapidly with lowering substrate temperature. In addition, the thermal conductivity of non-diamond carbon is much lower than that of diamond. Furthermore, a small-grain diamond film suffers from poor thermal conductivity due to frequent phonon scattering at grain boundaries. This paper reports a novel MPCVD process aiming at high growth rate, large grain size, and high sp3/sp2 ratio for diamond films deposited on silicon. Graphite paste containing nanoscale graphite and oxy-hydrocarbon binder and solvent vaporizes and mixes with gas feeds of hydrogen, methane, and carbon dioxide to form plasma. Rapid diamond growth of diamond seeds at 450 °C by the plasma results in large-grained diamond films on silicon at a high deposition rate of 200 nm/h.
Guu et al. (Tue,) studied this question.