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In this work, we demonstrate the application of laser induced forward transfer of metal nanoparticle inks and pastes for the additive manufacturing of linear Ag micro-electrodes on top of thermally sensitive and even multi-stack layers involving challenging surface topographies. The versatility of LIFT has been validated in three use cases: i) the fabrication of gate electrodes for flexible organic thin film transistors (OTFTs); ii) the development of metal grids in flexible organic photovoltaics (OPVs); iii) The combination of LIFT of lead-free solder paste and laser soldering for the digital assembly of optoelectronic integrated circuits (OEICs).
I. Zergioti (Tue,) studied this question.