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Recently, anisotropic heat dissipation and its management have drawn attention as a promising technique for highly integrated electrical devices. Among many potentially challenging materials such as carbon nanotube, graphene, metal particles, and inorganic ceramics commonly used for high thermally conductive fillers in a composite form, nanoscale ceramic fillers are considered ideal candidates due to their thermal conductivity, electrical insulation, and low thermal expansion coefficient. However, enhancing the thermal conductivity of a randomly dispersed ceramic-polymer composite is limited by its discontinuous filler contact and thermal expansion coefficient mismatch. Thus, recent research has focused on how to assemble and generate highly networked filler contacts to make effective pathways for heat flow, with minimized concentration of the filler in the composite. In this review, we will introduce several essential strategies to assemble fillers with a two- or three-dimensional networked composite for highly enhanced anisotropic heat dissipation. Moreover, this review elucidates filler alignment effects compared to randomly dispersed ceramic composites.
Hong et al. (Tue,) studied this question.