Strategy of Cost Reduction in Copper Chemical Mechanical Polishing: Enhancing Removal Rate and Uniformity Via a Novel Slurry Sweep Mode

Key Points

• Improved removal rate is achieved with the new slurry sweep mode, increasing efficiency in copper polishing.
• The uniformity of copper polishing is significantly enhanced, promoting high-quality outcomes in semiconductor manufacturing.
• Assessment used novel slurry sweep mode in copper polishing, focusing on chemical mechanical polishing techniques.
• This enhancement may enable cost-effective practices in semiconductor industries, reducing waste and improving yield.